Qualcomm Snapdragon 8150 SoC to come with tri-cluster CPU design: Report

Both Apple and Huawei have already launched their flagship chipsets, the A12 Bionic and Kirin 980, and now, it is time for Qualcomm to reveal its next-gen chip. According to a report that we came across last week, Qualcomm is hosting its yearly Technology Summit in Hawaii, and the flagship chipset could be announced at the event on December 4.

Successor to the Snapdragon 845, the new chipset won’t be called Snapdragon 855, instead, it will reportedly be called Snapdragon 8150. From what we learned earlier, the Snapdragon 8150 will be using an octa-core CPU design featuring four “Gold” and four “Silver” cores. However, as per the latest details that have surfaced online, Qualcomm may go for a completely new CPU design.

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Just like Huawei’s Kirin 980, the Qualcomm Snapdragon 8150 SoC will be made on 7nm process, and also come with a tri-cluster design. However, the setup will be a bit different. The Kirin 980 comes with two high-performance Cortex-A76 cores, two medium-performance Cortex-A76 cores, and four Cortex-A55 efficiency cores. In case of Snapdragon 8150, Qualcomm may adopt a 1+3+4 setup.

According to Twitter user @UniverseIce, the Snapdragon 8150 setup will include 1 Kryo gold prime core with maximum frequency of 2.84GHz (512KB L2 cache), followed by 3 Kryo gold cores with maximum frequency of 2.419GHz (256KB L2 cache), and lastly 4 Kryo silver efficiency cores clocked at 1.8GHz (128KB L2 cache). It will also come with Adreno 640 GPU, which is expected to offer 20 percent performance improvements.

The Snapdragon 8150 SoC was recently spotted on Geekbench listing where it logged a score of 3,281 in single core test and 11,023 in the multi-core test. The score is definitely better than single-core score of 2,500 and multi-core test score of 8,900 that Snapdragon 845 logged. The single-core score of 3,281 could very well be a result of Kryo gold prime core.